The Army actively participates in the Department of Defense (DoD) Joint Defense Manufacturing Technology Panel (JDMTP) to coordinate ManTech efforts and maximize leveraged funding across the Services, and the Defense Logistics Agency (DLA).
The JDMTP is composed of managers from the Army, Navy, Air Force and DLA ManTech Programs. This panel also includes an ex-offi cio representative from the Office of the Secretary of Defense (OSD).
The JDMTP defines a taxonomy under which DoD components coordinate technical projects to optimize the investment of funds for manufacturing process development. To meet its challenges, the JDMTP is structured around four technical subpanels to support the planning, execution, and implementation of both joint and Service-unique projects. Brief descriptions of the subpanels are included below:
― METALS PROCESSING AND FABRICATION SUBPANEL–
Provides manufacturing technology to develop affordable, robust processes and capabilities for evolutionary metals and special materials, joining and inspection
― COMPOSITES PROCESSING AND FABRICATION SUBPANEL –
Coordinates manufacturing technology projects that improve the processes used to produce composite structures in aircraft, ground vehicles, ships, and Soldier protective systems
― ELECTRONICS PROCESSING AND FABRICATION SUBPANEL –
Addresses manufacturing technology for electronic materials, devices, integrated circuits, subassemblies, and subsystems, including digital electronics, analog microwave and millimeter wave electronics, and photonic and electro-optics technologies
― ADVANCED MANUFACTURING ENTERPRISE (AME) SUBPANEL –
Encompasses the practices and procedures that foster collaborative and effective manufacturing enterprises including model based and network centric manufacturing environments, modeling and simulation capabilities, adaptive supply chains, and leveraged commercial practices
Information for Army ManTech Points of Contact to the JDMTP subpanels, click here