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Color 1280 x 1024 Micro-Display Manufacturing Technology

U.S. ARMY MANTECH

Develop a manufacturing process to provide affordable, high resolution, full-color micro-displays (.097” format) for insertion into Soldier borne, head mounted image fusion and weapon sight systems

OBJECTIVE / SOLUTION

Future Army imaging programs, such as the Enhanced Night Vision Goggle-Digital (ENVG-D), will rely on image fused, high resolution (1280 x 1024) sensors and displays to replace the current capabilities (such as standard night vision goggles). These systems will require an affordable, high performance, artifact free, low power, full color micro-display to meet the desired Key Performance Parameters (KPPs) of system weight, power, situational awareness, and target acquisition.

Performance and manufacturing goals include increased contrast ratio and transmission rate; increased viewing angle; decreased display response time and reduced display unit cost.

ACHIEVEMENTS

• Produced improved, thin backlights to reduce both power (by 0.25 watts) and size of the micro-displays
• Improved the full-function display companion Application Specific Integrated Circuit (ASIC)
• Display process improvements, combined with the improved backlight and ASIC, reduced the integrated micro-display power consumption to < 400 mW

BENEFITS

• An affordable, high performance, micro-display enables presentation of digital image fusion to increase Soldier mobility with multi-spectral imagery from two to three sensors.
• Reduction in cost allows for a larger procurement of imager systems. The program also developed lower power displays than the current display—approximately 1W, projected display < 0.5W and reduces the system power and the number of batteries required to complete the mission

STATUS

• Transitioned prototype displays to ENVG-D program for insertion into systems for Limited User Evaluation
• Government furnished equipment (GFE) 1280 x 1024 displays to Joint Effects Targeting System (JETS) program
• Transitioned prototype displays to Soldier Sensor Component and Image Processing Army Technology Objective (ATO)-R program
• 800 x 600 color display from 8” wafer line transitioned to ENVG-O program

WEAPON SYSTEMS / SECONDARY ITEMS IMPACTED

• Enhanced Night Vision Goggle–Digital
• Fused Weapon Sight (FWS)
• Night Sight-Semi Automatic Sniper System (NS-SASS)
• Handheld Target Locator - Talon+

POTENTIAL COST AVOIDANCE

• Return on Investment of 30.1 to 1 with a cost benefit of $154M


High Definition Multi-Band Focal Plane Arrays (HDMB FPAs)

Develop low cost substrates for third generation focal planes that will signifi cantly reduce focal plane costs and allow larger size focal plane arrays. This effort also will develop a small pixel format that will provide high defi nition image quality and improve overall system performance.

OBJECTIVE / SOLUTION

Develop large format, multi-band, multi-color Focal Plane Arrays (FPAs) at comparable costs to single band Indium Antimonide (InSb) FPAs. This will enable affordable, high definition television (HDTV) infrared (IR) sensors for enhanced situational awareness/target search.

ACHIEVEMENTS

• On site review of potential FPA vendors completed
• Night Vision and Electronics Sensors Directorate (NVESD) has completed in house testing of prospective vendors
• Method established to improve operability through gettering from Silicon (Si) substrates
• Improved buffer layer crystallinity ( < 30 arc sec)
• First set of baseline arrays on Gallium Arsenide (GaAs) substrates (640x480 20 micron pixel) show operability at 99%

BENEFITS

• Reduced quantity, cost, size, weight and power of IR cameras
• Provides increased field-of-view of dual band 3rd Generation FPAs
• Provides high definition, multi-band situational awareness
• Enables a new warfighting capability in urban environments using wide area electro-optic (EO) persistent surveillance from high altitude and from multiple, tactical unmanned aerial vehicles (UAVs) operating below the clouds

STATUS

• Program is in its second year of funding
• First year funding was through a task order
• Broad Area Announcement (BAA) announced in November 2010. One contract awarded and a second is pending
• Complete detector lot data on baseline 640x480 pixel, 20μm (2 color)
• Begin detector lot data on 1280x720 pixel, 12μm (2 color) on 6” wafers

WEAPON SYSTEMS / SECONDARY ITEMS IMPACTED

• Ground Combat Vehicles
• Tactical Unmanned Aerial Vehicle (TUAV) Q2, Q3
• Lightweight Laser Designator Rangefinder (LLDR)
• AH-64 Apache Helicopter
• Common Sensor Payload
• Joint Strike Fighter

POTENTIAL COST AVOIDANCE

• Return on Investment of 15.5 to 1 with a cost benefit of $664M

POC: Army ManTech Manager, U.S. Army Research, Development and Engineering Command (RDECOM), Communications-Electronics Research, Development and Engineering Center (CERDEC), Night Vision Electronics Sensors Directorate (NVESD), ATTN: RDER-NVS-STD, Ft. Belvoir, VA 22060-5806

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